Process Capability,ShenZhen Hong Long Technologies Co., LTD

HDI process capability
The highest number of layers (L): 20
HDI stacking capabilities: first-order, second-order overlapping holes, second-order overlapping holes, third-order overlapping holes, third-order overlapping holes
Special process capability: VOP (resin plug hole for buried hole)
Maximum single size (MM): 572 × 495
Minimum single size (MM): 50 × 50
Minimum core plate thickness (MM): 0.05
Maximum finished plate thickness (MM): 5.0
Minimum finished plate thickness (MM): 0.4
Copper thickness (OZ): 1/3 OZ, 1/2 OZ, 1 OZ, 2 OZ, 3 OZ, 4 OZ, 5 OZ, 6 OZ
Minimum line width (MM): 0.04
Minimum line spacing (MM): 0.05
Minimum mechanical drilling aperture (MM): 0.15
Minimum Laser Drilling Aperture (MM): 0.076
Impedance tolerance: ± 8%
Surface treatment: full board OSP, full board immersion gold, OSP + immersion gold, OSP + carbon oil, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, Shen silver

FPC application areas: mobile phones, imaging, wearables, notebook computers, game consoles, fingerprint recognition, electronic medical, electronic cigarettes, new energy vehicle power battery integrated busbars and other different fields.
Process Capability:
Material: Polyimide / Polyester PI (DuPont, Xinyang, Taihong, Nippon Steel, KANEKA)
Auxiliary materials: cover film (CVL), pure rubber, shielding film (EMI), reinforcing plate (PI, steel sheet, FR4, aluminum sheet, PET), double-sided adhesive, foam, shielding cover
The highest number of layers (L): 8
Maximum single size (MM): 500 × 600
Minimum single size (MM): 10 × 10
Board thickness: 0.05-0.3MM (pure 1-3 layers of soft board, multilayer depending on specific requirements)
Copper thickness (OZ): 1/3 OZ, 1/2 OZ, 1 OZ, 1.5 OZ, 2 OZ, 2.5 OZ
Minimum line width: 0.04MM
Minimum line spacing: 0.04MM
Etching tolerance: Line width ± 20 ﹪ Special: Line width ± 10 ﹪
Exposure registration tolerance: ± 0.05mm (2mil)
Minimum mechanical drilling hole diameter: 0.15MM,
Maximum mechanical drilling hole diameter: 6.5MM,
Minimum laser drilling aperture: 0.075MM
Impedance tolerance: ± 10%
Surface treatment: electro gold, immersion gold, OSP, OSP + immersion gold, OSP + electro gold, nickel-palladium gold, immersion tin, immersion silver
Shape: laser cutting of samples, die cutting of mass production molds, FR4 is gong plate
Shape tolerance (MM): Slow walking die ± 0.05, fast walking die ± 0.1mm
Auxiliary material tolerance: ± 0.2

Through-hole process capability
Maximum number of layers: 36 layers ● Material: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free sheet, PI material, BT material, PPO, PPE, mixed pressure, high frequency
● Substrate copper foil thickness: 1oz outer layer; 1 / 2oz inner layer
● Minimum line width / space: 2mil / 2mil
● Minimum drilling hole diameter: 0.2mm
● Minimum laser drilling aperture: 0.075mm
● Blind hole depth ratio: 1: 1
● Maximum finished product size: 500mm X600mm
● Surface treatment: There are lead spray tin, chemical immersion gold, immersion tin, immersion silver, full plate gold plating, OSP, lead-free tin spray, hard gold plating, gold finger, mixed surface treatment
● Solder mask color: white, black, yellow, red, green, matte, blue