computer
▶ competitive advantage

1. The company provides comprehensive services to customers with advanced technology, excellent quality and excellent service, and has established long-term and stable strategic cooperative relations with many internationally renowned companies.

2. Recognized by many Fortune 500 customers.


▶ R & D strength

1. Hundreds of professional R & D engineering teams with more than 10 years of PCB industry experience provide you with high reliability and high stability products and technical services.

2. More than 90 national invention patents, more than 240 utility model patents, 10 software copyrights and other technical achievements have been transformed into productivity, effectively optimizing product production quality and efficiency.

3. Provincial technology center as a technology development and technology service platform, won the national high-tech enterprise certification, has multiple high-tech product certification.

4. Because of focus, so professional. 20 years focused on research and development and manufacturing of printed circuit boards.


▶ Process technology

1. Has nearly 20 years of R & D and manufacturing experience in high-precision double-sided, high-layer printed circuit boards and thick copper plates.

2. Familiar with the requirements of impedance control and possess mature quality control and process expertise in the field of touch screen tablet computers, including ultra-thin core board structure, laser drilling, hole filling plating, and comprehensive reliability testing.

3. Under the premise of meeting the high performance requirements of the product, save comprehensive costs for customers.

4. With 10 years of accumulation and experience of fine dense lines and micro-hole technology, fully meet product design requirements.


▶ State-of-the-art production equipment

1. Laser Direct Imaging Exposure Machine (LDI): It reaches the industry's top technology, with a minimum line width / space of 40UM, which is used for graphic transfer of high precision and high density products.

2. Laser Drilling: It meets the minimum hole diameter of 0.05MM and is used to realize micro-hole processing.

3. Plating Filling: Meets the minimum Dimple 15UM, used to achieve high-density interconnect technology.


▶ Advanced testing equipment

1. Automatic Optical Inspection Machine (AOI): Automatic Optical Inspection Machine (AOI) for fine dense line detection.

2. High-precision impedance tester: meet the requirements of product impedance testing.

3. 3D blind hole scanner: Dimple 3D precise positioning detection of blind holes in each layer.


▶ Service Features

2 hours quick customer service response

4 hours fast quote support

7 * 24 hours fast technical support, order service, production operation, logistics support, express order delivery