Product parameters
● Product name: 4-layer immersion gold anti-oxidation board
● Type: multilayer circuit board
● Material: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free sheet, PI material, BT material, PPO, PPE, mixed pressure, high frequency
● Substrate copper foil thickness: 1oz outer layer; 1 / 2oz inner layer
● Minimum line width / space: 2mil / 2mil
● Minimum drilling hole diameter: 0.2mm
● Minimum laser drilling aperture: 0.075mm
● Blind hole depth ratio: 1: 1
● Maximum finished product size: 500mm X600mm
● Surface treatment: There are lead spray tin, chemical immersion gold, immersion tin, immersion silver, full plate gold plating, OSP, lead-free tin spray, hard gold plating, gold finger, mixed surface treatment
● Solder mask color: white, black, yellow, red, green, matte, blue
● Special technology: high-frequency mixed pressure, back drilling, crimping hole, metal substrate, buried capacitor technology, buried resistance technology, etc.


Detailed introduction
High multilayer board processing capacity
Number of floors: 36
Material: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free sheet, PI material, BT material, PPO, PPE, mixed pressure, high frequency (Roger, Arlon \ Taconic, Nelco, Taixing microwave F4B, Isola ...) ,
Minimum line width / space: 2mil / 2mil
Minimum drilling hole diameter: 8mil (0.20mm)
Maximum plate thickness aperture ratio: 16: 1
Maximum finished product size: Maximum board size: 23 ″ * 32 ″ (584mm * 812mm)
Surface treatment process: lead spray tin, chemical immersion gold, immersion tin, immersion silver, full plate gold plating, OSP, lead-free tin spray, hard gold plating, gold finger, mixed surface treatment
Solder mask color: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixing, back drilling, crimping holes, metal substrates, buried capacitor technology, buried resistance technology, etc.

Product Details: