Profile：High-frequency hybrid PCBs utilize high-frequency laminates characterized by low Dk and low Df values ​​within their signal layers, thereby effectively minimizing signal transmission delays, distortion, and attenuation, while simultaneously enhancing signal integrity. Furthermore, by combining high-frequency materials with standard substrates—such as FR-4—this approach ensures high-quality transmission of high-frequency signals while allowing for a degree of cost control during production. A well-engineered structural design ensures the consistency of characteristic impedance along the signal path—for instance, through the use of tapered trace widths or the incorporation of compensation structures to maintain impedance continuity.